RL-601I Mini 360° Rotary Fixture Motherboard Chip BGA Repair

RL-601I Mini 360° Rotary Fixture Motherboard Chip BGA RepairRelife RL 601I Multi function Universal Motherboard Chip BGA Repair Mini 360 Rotary Fixture with Split Drive Structure BGA Repair Holder for Phone Android Clamp Tin Planting Table. RELIFE TF1 Mini and Relife TF2 Plus tempered heat insulating glass motherboard chip fixture for mobile phone iPad tablet repair. RELIFE TF1 Mini insulated glass clamp for mobile phone PCB board and BGA CPU chip glue removal. RELIFE TF2 Plus motherboard insulated tempered

Relife RL-601I Multi-function Universal Motherboard Chip BGA Repair Mini 360° Rotary Fixture with Split Drive Structure BGA Repair Holder for Phone Android  Clamp Tin Planting Table.

RELIFE TF1 Mini and Relife TF2 Plus tempered heat-insulating glass motherboard chip fixture for mobile phone/iPad/tablet repair. RELIFE TF1 Mini insulated glass clamp for mobile phone PCB board and BGA CPU chip glue removal. RELIFE TF2 Plus motherboard insulated tempered glass holder fixture for Phone motherboard soldering repair.

Features:
Motherboard chip repair mini rotary fixture
Universal chip slot structure
360° omnidirectional rotation
High temperature resistance
Split drive structure design
High quality environmentally friendly stone, high strength, anti-dirt, easy to clean.

Description:
1. 360° all-round controllable detachable turntable, rotating base makes maintenance easier, suitable for motherboard maintenance, chip removal, etc.
2. The fixture features firmly clamped, weighted base, high temperature and corrosion resistance, fast heat dissipation.
3. Small and practical. It can be placed on the microscope disc base, desktop and other scenes for maintenance and use.
4. Wear-resistant and non-slip, shock absorption and compression resistance, anti-aging, enhanced stability, more convenient maintenance.
5. Split drive structure design, 360° all-round controllable detachable turntable, suitable for motherboard maintenance, chip removal, etc.,

Product Parameters:
Model: TF1 Mini
Product Size: 815024mm
Packing Size: 1087735.5mm
Net Weight: 142g
Gross Weight: 184g

TF2 Plus Motherboard Glass Fixture for Mobile Phone Repair Features:
Precise Clamping: Inward bevel design ensures a firm grip on motherboards, effectively preventing heat loss during repairs.
High Compatibility: Dual-direction movement allows compatibility with various chipsets, CPUs, and hard drives, supporting diverse repair needs.
High Temperature Resistance: Made from toughened glass, it withstands temperatures up to 500°C without deforming.
Easy to Clean: The glass surface is corrosion-resistant and can be easily wiped clean for hassle-free maintenance.
Compact and Portable: Lightweight design makes it suitable for various mobile motherboard repairs, ensuring easy handling.
Smooth Operation: Glide rail movement allows for precise positioning without obstruction, ensuring reliable clamping for chip and motherboard applications.

Product Parameters:
Model: TF2 Plus
Product Size: 153mm x 90mm x 23mm
Packing Size: 180mm x 115mm x 35mm
Net Weight: 323g
Gross Weight: 408g

The TF1 Mini is a compact fixture designed for chip handling, providing precise clamping for various mobile motherboards. The TF2 Plus is specifically engineered for mainboard repairs, offering enhanced compatibility and secure clamping for a wide range of chip types. Both fixtures feature high-temperature resistant glass, ensuring durability and reliability during maintenance tasks.